Punch and dies are fundamental components in the transfer molding process for IC packaging. Their accurate design, precise machining, and proper alignment contribute to the creation of well-formed and reliable IC packages. As the semiconductor industry advances, ongoing developments in punch and die technologies enable the production of smaller, more sophisticated IC packages, supporting the growth of innovative electronics applications.
Cavity inserts are the main components of the mold that define the shape and dimensions of the packaged IC. They are precision-engineered to accommodate the specific dimensions of the IC chip and its interconnections. Cavity inserts are typically made from high-quality materials such as steel or tungsten carbide to ensure durability and dimensional accuracy.
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